KUKA機器人示教器上電屏幕顯示白屏維修檢測

 工(gong)業機(ji)(ji)(ji)器人伺服驅動器常見故(gu)(gu)障現(xian)象(xiang)有：驅動器報(bao)警維(wei)(wei)修(xiu)(xiu)(xiu)、無顯示維(wei)(wei)修(xiu)(xiu)(xiu)、缺(que)相維(wei)(wei)修(xiu)(xiu)(xiu)、過(guo)流維(wei)(wei)修(xiu)(xiu)(xiu)、過(guo)壓維(wei)(wei)修(xiu)(xiu)(xiu)、欠壓維(wei)(wei)修(xiu)(xiu)(xiu)、過(guo)熱(re)維(wei)(wei)修(xiu)(xiu)(xiu)、過(guo)載(zai)維(wei)(wei)修(xiu)(xiu)(xiu)、接地故(gu)(gu)障維(wei)(wei)修(xiu)(xiu)(xiu)、參數錯誤維(wei)(wei)修(xiu)(xiu)(xiu)、有顯示無輸出(chu)維(wei)(wei)修(xiu)(xiu)(xiu)、編碼(ma)器報(bao)警維(wei)(wei)修(xiu)(xiu)(xiu)、模塊(kuai)損壞維(wei)(wei)修(xiu)(xiu)(xiu)等(deng)；3.工(gong)業機(ji)(ji)(ji)器人主機(ji)(ji)(ji)常見故(gu)(gu)障現(xian)象(xiang)有：開(kai)不(bu)(bu)了(le)機(ji)(ji)(ji)維(wei)(wei)修(xiu)(xiu)(xiu)、上(shang)電后不(bu)(bu)工(gong)作維(wei)(wei)修(xiu)(xiu)(xiu)、開(kai)機(ji)(ji)(ji)進不(bu)(bu)了(le)系統維(wei)(wei)修(xiu)(xiu)(xiu)

 　電(dian)(dian)(dian)(dian)(dian)子設備(bei)(bei)(bei)在工作的(de)(de)時候產生了(le)熱(re)(re)(re)量，使設備(bei)(bei)(bei)內部溫(wen)度(du)迅速上升(sheng)，引起kuka機(ji)器(qi)人電(dian)(dian)(dian)(dian)(dian)路(lu)板溫(wen)升(sheng)的(de)(de)直(zhi)接原(yuan)因(yin)是機(ji)器(qi)人電(dian)(dian)(dian)(dian)(dian)路(lu)板維修由于電(dian)(dian)(dian)(dian)(dian)路(lu)功耗器(qi)件(jian)的(de)(de)存在，電(dian)(dian)(dian)(dian)(dian)子器(qi)件(jian)均不同程度(du)地存在功耗，發熱(re)(re)(re)強度(du)隨功耗的(de)(de)大(da)小變化，若不及時將該熱(re)(re)(re)量散(san)發，設備(bei)(bei)(bei)會持續升(sheng)溫(wen)，器(qi)件(jian)就(jiu)會因(yin)過熱(re)(re)(re)失效(xiao)，電(dian)(dian)(dian)(dian)(dian)子設備(bei)(bei)(bei)的(de)(de)機(ji)器(qi)人電(dian)(dian)(dian)(dian)(dian)路(lu)板維修可(ke)靠性將下降。因(yin)此，對(dui)KUKA機(ji)器(qi)人電(dian)(dian)(dian)(dian)(dian)路(lu)板進(jin)行散(san)熱(re)(re)(re)處理十分重要。

 KUKA機器人示教器上電屏幕顯示白屏維修檢測那么KUKA機(ji)器(qi)人(ren)(ren)電路板(ban)(ban)發(fa)熱(re)(re)問(wen)(wen)題該如(ru)何解(jie)決(jue)呢此(ci)類問(wen)(wen)題一(yi)般(ban)要(yao)通過加裝(zhuang)散(san)熱(re)(re)裝(zhuang)置或風扇對線路板(ban)(ban)進行冷卻來解(jie)決(jue)。這些(xie)機(ji)器(qi)人(ren)(ren)電路板(ban)(ban)維(wei)修外接附件(jian)增(zeng)加了成本，而(er)且延長(chang)了制造時(shi)間，在(zai)(zai)設計(ji)中加入風扇還會(hui)給可靠(kao)性帶來不(bu)穩定(ding)因(yin)(yin)素，因(yin)(yin)此(ci)線路板(ban)(ban)板(ban)(ban)主(zhu)要(yao)采用主(zhu)動(dong)式(shi)而(er)不(bu)是被(bei)動(dong)式(shi)冷卻方(fang)式(shi)。高(gao)熱(re)(re)耗散(san)器(qi)件(jian)在(zai)(zai)與基板(ban)(ban)連接時(shi)應盡能減(jian)少(shao)它們之間的(de)熱(re)(re)阻。為(wei)了機(ji)器(qi)人(ren)(ren)電路板(ban)(ban)維(wei)修更好地滿(man)足(zu)熱(re)(re)特性要(yao)求，在(zai)(zai)芯片底面可使用一(yi)些(xie)熱(re)(re)導材料(liao)（如(ru)涂抹一(yi)層導熱(re)(re)硅膠），并保持一(yi)定(ding)的(de)接觸區域供器(qi)件(jian)散(san)熱(re)(re)。